Technology & Capability

Production Capabilities:

  • Product design and mold design capability.
  • SMT Flex PCB soldering process provide good soldering quality PCB and FPC.
  • Hotbar FPC and PCB soldering processes to provide another solution.
  • We support PCB thickness ≤0.4 mm and FPC production.
  • The conformal coating process provides extra protection for the PCBA surface improving PCBA reliability.

SMT Process Capability

Centron is equipped with state-of-the-art equipment and customized manufacturing processeses tailored to customer requirements. The process is set up as to eliminate waste while ensuring high productivity levels and low scrap rates.

Our experienced process and quality team takes special care with prototypes and conduct weekly NPI meetings to monitor the progress of each NPI build as well as to record process difficulties for improvement on the next build.

Test Capability

Appearance Test: Automatic Optical Inspection (AOI), Polarity device, Missing components, and X-ray inspection for BGA Solder Joints.
In-Circuit Test (ICT): Checks for shorts, opens, resistance, capacitance, and other basic quantities which will show whether the assembly was correctly fabricated.
Flying Probe test for PCBA: Often used for testing basic production, prototypes, and boards that present
accessibility problems. Flying probe testing uses electro-mechanically controlled probes to access
components on the PCBA.
Functional Test:
A) PCBA Functional Test (including Voltage, Current, Pattern, Signal, Device Read/Write, etc.)
B) End-User simulation test
C) Customized services integrated with Taiwan to set up specialized test system for each customer’s products base on requirements (incl. test procedures, test fixtures, and test programs)

Process Capabilities: